微波等离子体系统（去胶机）：

用途：

• Removal of Photoresist ( after high-dose implant)（高剂量注入后）光刻胶的去除

• After or before wet or dry etching process用于湿法或干法刻蚀工艺前后

• SU 8 and other resists based on epoxy   SU-8和其它环氧基光胶的去除

• Sacrificial layers in MEMS fabrication微电子机械系统加工中牺牲层去除

• Desorption of chemical residues去除化学残余物

• Descum Process清除浮渣工艺

应用领域：

Photoresist and SU-8 Processing   in Semiconductor Wafer Fabrication   半导体硅片生产中光刻胶或SU-8胶工艺
Plasma Pre-Treatment   In Flat Panel Production   平板显示生产中等离子体预处理
Edge Isolation and Texturing   In Solar Cell Manufacturing   太阳能电池生产中边缘绝缘和制绒
Substrate Cleaning and Pre-Treatment   In Advanced Chip Assembly   先进晶片（芯片）装配中的衬底清洁和预处理

优势：

• Avoids resist popping after high-dose implant预处理可避免光刻胶在高剂量离子注入后破裂

• Soft removal of crust硬胶的轻柔去除

• Maximum temperature of 230°C最高温度为230摄氏度

• Slow temperature ramp – up温升慢

• High density of radicals高密度激发态原子团

• Shorter Process time工艺时间短

• Lowest self bias voltage， low damage最低的自偏压，低损伤