heliInspectTM H6 - Industrial White-Light Interferometer
The heliInspectTM H6 has been engineered to meet the specifications of the most demanding 3D in-line inspection tasks such as measuring
step heights， angles， shapes roughness， ripple， waviness defects， scratches， wear off flatness， coplanarity， deformations film thickness (tomographic mode)
Benefitting from Heliotis' long experience with 3D sensors for industrial applications， the H6 combines interferometric precision with robustness and high throughput. System integrators benefit from ease of integration， a rugged design and designed-in reliability. The H6 is applicable to a wide range of inspection tasks and produces repeatable results on difficult targets such as hybrid metal/Polymer objects. Equipment manufacturers benefit from the modular architecture of the H6 platform， access to sophisticated firmware features， software development kits and Heliotis' design-in expertise. The standard capabilities may be extended by custom features (e.g. optics， CMOS image sensor， electronics， FPGA， software， mechanics). |
The new 3D vision module can be mounted on most motorized positioning systems.
Pre-qualified stages are also available from Heliotis and partners
Software interfaces include C++， Halcon 11， LabView 2013 and Python
H6 / WLI6 Specifications
heliInspect™ H6
| measurement head | industrial White-Light Interferometer compatible with exchangeable heliOptics™ WLI6 interferometer modules |
| acquisition device | custom high-speed CMOS sensor with in-pixel signal processing |
| light source | integrated high power LED (standard) or SLED (optional) |
| dimensions (L x W x H) | 147 mm x 75 mm x 45 mm |
| weight | 800 g (excluding WLI6) |
| software | software development kits (SDK) for Halcon， LabView， C++， Python |
heliOptics™ WLI6
| Interferometer | Mirau | Mirau | Mirau | Michelson | Michelson | Michelson |
| field of view | 232 x 222 μm2 | 580 x 556 μm2 | 1.16 x 1.11 mm2 | 1.47 x 1.41 mm2 | 2.93 x 2.81 mm2 | 5.86 x 5.62 mm2 |
| working distance | 2.52 mm | 3.57 mm | 3.57 mm | 14.1 mm | 55.8 mm | 56.6 mm |
| WLI module | MIRAU-X50 | MIRAU-X20 | MIRAU-X10 | TG-R5 | TG-R10 | TG-R20 |
| numerical aperture | 0.5 | 0.4 | 0.3 | 0.17 | 0.11 | 0.07 |
| lateral resolution | 0.8 μm | 2 μm | 4 μm | 5 μm | 10 μm | 20 μm |
resolution RMS (phase mode) | 50 nm (1 nm) | 70 nm (1 nm) | 100 nm (1 nm) | 100 nm (2 nm) | 100 nm (2 nm) | 100 nm (2 nm) |
| repeatability | 100 nm (2 nm in phase mode) | 100 nm (5 nm in phase mode) |
| reflectivity of sample | < 0.1% to 100% |
heliOpticsTM WLI6 White-Light Interferometer modules: Mirau configurations (left) and Michelson configurations (right)
Applications
Providing fast and robust 3D-metrological data， Heliotis' unique technology is capable of bringing innovations to many different fields - limited only by your imagination.
To explore what our technology can do for you， please send us a short description of your measurement task. We will gladly perform test measurements of your samples free of charge.
Electronics， Technical Surfaces
CSPs and micro-BGAs continue to increase the packaging density of PCBs， but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration， monitor process statistics for SPC and increase First Pass Yield. Likewise， the requirement on technical surfaces typically increases with miniaturization as surfaces roughness become more significant and tolerances smaller. True 3D-inspection yields unambiguous quality data and can provide feedback to the manufacturing process. |
Micro-mechanics， Micro-optics
Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range， conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified. The M3 helps the developer to quickly gain an in-depth understanding of the true 3D shapes produced by a set of process parameters. The M3 takes 3D profiles of almost any material (reflective and diffusive). For inspection no preparation of the devices is necessary. |
Life Science
The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light. In contrast to scanning electron microscopes， the samples do not need to be coated or evacuated. Thus， the M3 allows for rapid characterization of biological samples and even delivers quantitative 3D data. |
Forensics & Security Solutions
Fnology is used for comparing cartridge cases from crime scenes， demonstrating superior performance over legacy 2D systems. Furthermore， the detailed 3D-metrology is instrumental in detecting counterfeits and forgery. There are numerous possibilities for innovative security products based on micro 3D-features. The M3 is the perfect tool for creating it. |
